Work in LFoundry

  1. Contribute

    Join the LFoundry team and contribute to the innovative solutions that bring our customers’ ideas to life.

  2. Challenge

    You can help LFoundry to shape innovation on a global scale by working to make our customers’ visions a reality, no matter how big the challenge is.

  3. Transforming

    Work with us and become an essential player, transforming innovation into reality.

SPC Charts Control Limits Characterization

  • Working area: Quality & Controlling
  • Facility: Avezzano (Italy)
  • Job time: internship/thesis

A part of the program of the SPC Control Methodology revamp, we need support to analyze and assess the current Control Limits and Out of Control Alarms setup on SPC charts.

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Adjust Planning Software with new MES System (Eyelit)

  • Working area: ICT
  • Facility: Avezzano (Italy)
  • Job time: internship/thesis

In LFoundry the Planning team use a Micron S/W (PDM) to elaborate fab capacity scenarios in order to evaluate the feasibility to accept new customer demands.
A capacity scenario computation is based on production data coming from MES (Manufacturing Execution Systems)  , like product cycle time, equipment availability, equipment constraints, equipment throughput ,number and mix  of products  in line.
Since Lfoundry is working to replace the current MES  with a new third party software provided by Eyelit , there is the need to reengineering the current planning business 
System to either align it to the new third part s/w and to new business needs.

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Build and Optimize Report data with new MES System

  • Working area: ICT
  • Facility: Avezzano (Italy)
  • Job time: internship/thesis

LFoundry is working to replace Manufacturing Execution Systems with a new third party software provided by Eyelit. We should aggregate business requirements elaborating a new logic for data presentation.

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Study on analytical recovery capability for metal elements from silicon wafer surface by VPD/ICP-MS

  • Working area: R&D
  • Facility: Avezzano (Italy)
  • Job time: internship/thesis

Optical performances of CMOS imagers can be affected by contamination caused by several elements found, even if in extremely low concentration, in semiconductor production environment.
In particular, contamination by noble elements like, for example, Gold or Silver, is extremely critical since these elements have a very low migration rate in the silicon, so they are not easily segregated into the gettering sites. They remain electrically active, and contribute to the so called “hot pixel” defects.
Unfortunately, the noble elements are also very difficult to be effectively detected by VPD/ICP-MS, the technique traditionally and successfully used to detect most of the other elements (like Fe, Cr, Ni, Na, Ca...).
In fact, the chemical mixtures typically used to dissolve noble metals (like Aqua Regia) are very aggressive to the silicon substrate as well, damaging the wafer surface and making recovery by the automated equipment used for this technique (VPD) very difficult and not reliable.
In order to allow the implementation of routine analysis for the full elemental range of interest, alternative chemistries should be defined (through theoretical modeling and analytical test confirmation), capable to assure acceptable analytical recovery for noble elements and the other common elements at same time.

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