Blade Dicing

With our fully automatic Disco Dicing machines DFD-651, we can dice your wafers (from fragments up to 200mm, notch or flat) or your ceramic substrate in ESD-safe environment. In a dual step cut process smallest kerf down to 60µm width can be offered as a standard.

• Silicon wafer
  • From fragments up to 200mm
  • Notch and Flat
  • ESD safe
  • Kerf width down to 60 µm
  • Minimal backside chipping
• Ceramic substrates (Al2O3, LTCC)
  • Coated and uncoated
• Glass (boron silicate, etc.)
• Other material on request

On request, we can offer a die strength measurement after wafer dicing based on the three-bar principle.