Stress Relief

For LFoundry customers requiring additional stress relief or with special requirements to the backside roughness, we can add an optional backside etching process on our fully automatic SEZ spin-processors 203. Micro cracks due to grinding are eliminated by this process. This process reduces wafer warpage and improves die strength.

Long Experience and Highest Quality: With more than 20 years of manufacturing experience and highly qualified engineers in grinding, we use deep knowledge from major IDMs.Our grinding and etching process produces unsurpassed quality, including ultra-thin applications

• Silicon wafer 200mm
• Down to 50 µm
• Notch and Flat