Grinding

LFoundry provides high-volume precision semiconductor wafer grinding at its state-of-the-art facilities. LFoundry grinds wafers on DISCO DFG-850 to the tight tolerances required for bonded wafer, dielectric isolation, MEMS, optical devices, and other precision technologies. LFoundry can grind your 200mm wafers with process technologies down to 50µm.

• Silicon wafer to 200mm
• Down to 50 µm
• Notch and Flat
• For Backside metallization or other applications LFoundry offers thin-wafer support systems such as ESC (Electrostatic Carrier), permanent or temporary bonding for various carrier types