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Back-End Service
- Offers flexible solutions for stand-alone backend services
- Supports foundry service with backend services enabling shortest time to market
Combined with long experience in volume manufacturing and best tool sets, LFoundry offers full in-house services including: - Backside applications, offering thin-wafer support systems such as ESC (Electrostatic Carrier) and permanent or temporary bonding for several carrier types
- Wafer Grinding
- Stress relief
- Dicing
- In-house prototype sample packaging. For mass production packaging, LFoundry can assist with selected network partners on full-backend, supply-chain solutions
- Wafer Probing
- State-of-the-art, fully automated equipment
- Class 1000 clean-room environment
- ISO9001,14001,15408 and TS16949
- Production volumes - low volumes and prototyping
- Quick-time service and on-time delivery
Please contact sales@lfoundry.com for quotation.
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