Prototype Sample Packaging & Reliability Tests

Based on experience of more than 25 years a quick prototype sample packaging can be offered within a few days after Wafer finishing process based on open/closed Packages DIP28, SOIC20, JLCC68, QFN40 and DIP-64S. Further packages can be prepared on request.

In addition for DIP-64S also a small volume massproduction including reliability testing such as HTOL, T-cycling, PCT, HAST according MIL/JESD standards can be offered.
Please contact sales@lfoundry.com for quotation.

Packages

DIP28	SOIC20	JLCC68	QFN40	DIP-64S