Foundry Facts

LFoundry Business Model

• Providing dedicated foundry capacity and services for
• Specialized analog, mixed signal designs
• Customer specific technologies
• Joint technology developments
• Offering worldwide customers advanced process technologies and a robust portfolio of IP, innovative technology extensions and certifications.
• Featuring flexibility and reliability to meet aggressive on-time delivery demands.
• Ensuring peace of mind for customers with product design life cycles of 10 years or more through unique and complete “Sicherheit” protection of designs, IP and supply.

Manufacturing

Dedicated 200mm foundry capacity at Landshut, Germany and Rousset, France fabrication facilities. The facilities support process technologies down to 0.11µm.

More than 1,000 dedicated employees operate these two fabs with yields exceeding 98 percent, DPM of 1.2 (days per mask layer), reflecting industry benchmark.

The Landshut fab, which commenced wafer production in 1992, features a 5000m² class 1 clean room and produces more than 12,000 wafers output per month.

The Rousset fab, which was established in 1996, includes a >10000m² class 1 clean room and produces more than 20,000 wafers output per month.

Fab Automation: the fabs are equipped with an automated lot transportation system, automated recipe download and EDP lot dispatch systems that drive high-yield wafers from prototypes to volume production with speedy TAT (Turn-Around Time) and 100 percent on-time delivery.

Process Technologies and Services

Leading analog, mixed signal and customized CMOS technologies.

• Well proven process technologies from 0.35µm, 0.15µm with a technology roadmap to 0.11µm.
• Modular Foundry Process Design Kits (PDK) including large IP and library portfolio
• Highest RF performance at 0.15µm
• Foundry capabilities for low-power and high-speed applications
• Innovative technology extensions for Embedded Memory, High Voltage, Opto-CMOS applications and CMOS based MEMS capabilities